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RadTech
UV/EB Technology Conference & Expo 2008
May 4-7, 2008
Lakeside Center at McCormick Place
Chicago, Illinois - United States of America
ELECTRONICS
Effect of the Composition
Variables on the UV Curing Behavior
of Conductive Ink Formulations
Samali Datta, North Dakota State University
Abstract:
Solvent-free UV-hardenable conductive ink formulations for printed
microelectronics were designed to retain thermoplastic behavior after
UV exposure. The binder system consists of a monofunctional liquid
acrylate monomer along with an acrylic resin as viscosity modifier/
stabilizer for conductive particles. Conductive fillers used for this
system were different types of silver particles in the micrometer
and nanometer sizes. The kinetics of the photopolymerization and degree
of conversion were studied by real time FTIR (RT-FTIR) and photodifferential
calorimetry (photoDSC) experiments. Increasing silver particle concentration
reduced the conversion of double bonds. Formulations containing silver
nanoparticles had lower conversion than those with silver flakes.
At higher filler loading, it was necessary to employ dual curing technique
(UV followed by thermal) to get optimum conversion.
Scratch-Resistant
UV-Curable Coatings for Advanced Display Films
Andrei Sharygin, Sabic Innovative Plastics
Abstract: Scratch-resistant coatings improve durability and
product performance. This is especially important for Advanced Display
Films (IlluminexTM ADF) where the surface is coated with a textured
layer that provides a specific function such as brightness enhancement.
A new methodology was developed to evaluate scratch resistance of
UV-curable coatings for ADF. Scratch visibility and surface profileometry
were studied as a function of controlled scratch force. The results
of this study will be presented and discussed.
Screen
printable UV curing electronic inks.
James S Tonge, Dow Corning Corporation
Abstract: Printable electronics is the convergence of traditional
bulk printing processes and electronic. The objective it to mass
produce electronic components such as transistor circuits, displays,
sensors, batteries, photovoltaic's and EL lights. Printable electronic
devices' are often composed of multiple printed layers of dissimilar
materials with different functions, cure chemistries, surface chemistries,
and rheology's. This paper will discuss the problems and solutions
encountered in the screen printing of conducting, capacitive and
protective inks on flexible substrates.
Study
on Properties of Photosensitive Polysiloxane Urethane Acrylate
for Solder Mask
Fang Sun, Beijing University of Chemical
Technology
Abstract: The photosensitive and physical and mechanical
properties of a novel polysiloxane urethane acrylate (PSUA) for
solder mask were investigated using RTIR, DMTA and TGA. It is noted
that the PSUA system showed a notable photosensitivity and a good
compatibility with the acrylic monomers and resins. PSUA cured film
exhibited excellent tensile strength, thermal property, water resistance,
chemical resistance and toughness. PSUA resin can be used as solder
mask materials for printed circuit.
UV
Cured Flexible Cholesteric Liquid Crystal Displays
Dr. Tod Schneider, Kent Displays, Inc.
Abstract: Flexible Cholesteric Liquid Crystal Displays (LCDs)
have been rapidly maturing into a strong contender in the flexible
display market. Encapsulation of the Cholesteric liquid crystal
permits the use of flexible plastic substrates and roll-to-roll
production. Recent advances include ultra-thin displays, laser-cut
segmented displays of variable geometry, and smart card applications.
Exciting technologies such as UV curing, and simultaneous laser-edge
sealing/singulation enable high volume production, excellent quality
control and non-traditional display geometries and formats.
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